UTAC announced a license for iBGA packaging technology

UTAC announced a license for iBGA packaging technology

tenco 2019-04-15

UTAC Holdings Ltd. (UTAC), a global provider of semiconductor testing and assembly services, announced that it has obtained a patent license related to a company's imaging spherical array array (iBGA) packaging technology through its subsidiary UTAC Headquarters Pte. Ltd.Under the patent license agreement, UTAC and its affiliates have all rights to manufacture, apply and sell products based on iBGA packaging technology.


The technology license will be primarily used for image sensor packaging/assembly, including automotive and industrial cameras, as well as security, computing and consumer applications.Both important markets for the automotive and industrial sectors are growing rapidly, especially as more automakers install multiple cameras in their vehicles to support advanced driving assistance systems (ADAS).The use of these cameras is expected to grow even faster as vehicles eventually move toward full autonomous driving.Thanks to the rapid growth of applications such as machine vision, this technology is also showing strong growth in the industrial sector.

UTAC has extensive experience in the mass production of image sensor assembly and testing, especially in serving front-line customers in the industrial, consumer and automotive markets.These customers are very demanding on product quality, and UTAC ensures high product quality through its Class 10 clean room environment dedicated to front-end packaging processes that assemble wafers into products (including the new iBGA technology) and subsequent testing.

With advances in image sensor technology, UTAC can help designers transition to smaller image sensor sizes through optimized substrate designs.

The new iBGA packaging technology is ready for production and meets relevant automotive standards.Many leading automotive equipment suppliers have shown great interest in the technology.

TENCO-TECH

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